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Finite Volume Method Study on Contact Line Jump Phenomena and Dynamic Contact Angle of Underfill Flow in Flip-Chip of Various Bump Pitches
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Journal Title: | IOP Conference Series: Materials Science and Engineering |
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Authors and Corporations: | , , |
In: | IOP Conference Series: Materials Science and Engineering, 530, 2019, 1, p. 012012 |
Type of Resource: | E-Article |
Language: | Undetermined |
published: |
IOP Publishing
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