Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems

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Authors and Corporations:	Mueller, Steve, Waechtler, Thomas, Hofmann, Lutz, Tuchscherer, Andre, Mothes, Robert, Gordan, Ovidiu, Lehmann, Daniel, Haidu, Francisc, Ogiewa, Marcel, Gerlich, Lukas, Ding, Shao-Feng, Schulz, Stefan E., Gessner, Thomas, Lang, Heinrich, Zahn, Dietrich R.T, Qu, Xin-Ping
Title:	Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems
Type of Resource:	E-Book
Language:	English
published:	Piscataway IEEE 2011 Online-Ausg.. 2012
Series:	Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems; Semiconductor Conference Dresden (SCD), 27-28 Sept. 2011, Dresden, Germany; DOI: 10.1109/SCD.2011.6068736
Subjects:	Atomlagenabscheidung Ald Ruthenium Ameisensäure Wasserstoff Reduktion Ulsi Metallisierung Galvanik Spintronik Atomic Layer Deposition Copper Oxide Formic Acid Hydrogen Reduction Interconnect Electrochemical Deposition Ecd Spintronics Kupferoxid Metallisieren Galvanische Beschichtung Kupfer Konferenzschrift
Source:	Qucosa

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