Mueller, S., Waechtler, T., Hofmann, L., Tuchscherer, A., Mothes, R., Gordan, O., Lehmann, D., Haidu, F., Ogiewa, M., Gerlich, L., Ding, S., Schulz, S E., Gessner, T., Lang, H., Zahn, D R., & Qu, X. (2011). Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems. Piscataway: IEEE.

Thermal ALD of Cu via Reduction of CuxO films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems . — Piscataway : IEEE, 2011

Mueller, Steve, et al. Thermal ALD of Cu Via Reduction of CuxO Films for the Advanced Metallization in Spintronic and ULSI Interconnect Systems.Piscataway: IEEE, 2011.