Analysis on Stress Screening of Components in Digital Background

Gespeichert in:

Bibliographische Detailangaben
Zeitschriftentitel:	Journal of Physics: Conference Series
Personen und Körperschaften:	Wei, Juan, Sun, Hongbo, Chen, Jie
In:	Journal of Physics: Conference Series, 1828, 2021, 1, S. 012100
Format:	E-Article
Sprache:	Unbestimmt
veröffentlicht:	IOP Publishing
Schlagwörter:	General Physics and Astronomy

Details
Zusammenfassung:	<jats:title>Abstract</jats:title> <jats:p>This paper introduces various common defects and corresponding screening methods of electronic components. Aiming at the temperature cycle and random vibration methods with good screening effect, the calculation formula of accelerating factor and screening strength in highly accelerated stress screening (HASS) test is introduced. Based on the above discussion, the stress screening test steps of electronic components are summarized to guide the selection of reasonable stress screening items and levels for electronic components.</jats:p>
Umfang:	012100
ISSN:	1742-6588 1742-6596
DOI:	10.1088/1742-6596/1828/1/012100