Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points

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Published in:	Scientific reports 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
Authors and Corporations:	Kaltwasser, Mahsa (Author), Schmidt, Udo (Author), Lösing, Lars (Author), Biswas, Shantonu (Author), Stauden, Thomas (Author), Bund, Andreas (Author), Jacobs, Heiko O. (Author)
Title:	Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points/ Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs
Type of Resource:	E-Book Component Part
Language:	English
published:	2019
Series:	: Scientific reports, 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8 , volume:9
Source:	Verbunddaten SWB Lizenzfreie Online-Ressourcen

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