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Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points

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Veröffentlicht in: Scientific reports 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
Personen und Körperschaften: Kaltwasser, Mahsa (VerfasserIn), Schmidt, Udo (VerfasserIn), Lösing, Lars (VerfasserIn), Biswas, Shantonu (VerfasserIn), Stauden, Thomas (VerfasserIn), Bund, Andreas (VerfasserIn), Jacobs, Heiko O. (VerfasserIn)
Titel: Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points/ Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs
Format: E-Book-Kapitel
Sprache: Englisch
veröffentlicht:
2019
Gesamtaufnahme: : Scientific reports, 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
, volume:9
Quelle: Verbunddaten SWB
Lizenzfreie Online-Ressourcen
LEADER 02454caa a2200517 4500
001 0-1669944182
003 DE-627
005 20231026104611.0
007 cr uuu---uuuuu
008 190724s2019 xx |||||o 00| ||eng c
024 7 |a 10.1038/s41598-019-47690-8  |2 doi 
035 |a (DE-627)1669944182 
035 |a (DE-599)KXP1669944182 
040 |a DE-627  |b ger  |c DE-627  |e rda 
041 |a eng 
100 1 |a Kaltwasser, Mahsa  |e VerfasserIn  |0 (DE-588)120660607X  |0 (DE-627)1692695185  |4 aut 
245 1 0 |a Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points  |c Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs 
264 1 |c 2019 
336 |a Text  |b txt  |2 rdacontent 
337 |a Computermedien  |b c  |2 rdamedia 
338 |a Online-Ressource  |b cr  |2 rdacarrier 
700 1 |a Schmidt, Udo  |e VerfasserIn  |0 (DE-588)1204931372  |0 (DE-627)1690205067  |4 aut 
700 1 |a Lösing, Lars  |e VerfasserIn  |4 aut 
700 1 |a Biswas, Shantonu  |d 1986-  |e VerfasserIn  |0 (DE-588)1161959513  |0 (DE-627)1025470966  |0 (DE-576)507038045  |4 aut 
700 1 |a Stauden, Thomas  |e VerfasserIn  |4 aut 
700 1 |a Bund, Andreas  |d 1969-  |e VerfasserIn  |0 (DE-588)12967477X  |0 (DE-627)477115330  |0 (DE-576)188639063  |4 aut 
700 1 |a Jacobs, Heiko O.  |d 1970-  |e VerfasserIn  |0 (DE-588)103023244X  |0 (DE-627)734945639  |0 (DE-576)378035339  |4 aut 
773 0 8 |i Enthalten in  |t Scientific reports  |d [London] : Macmillan Publishers Limited, part of Springer Nature, 2011  |g 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8  |h Online-Ressource  |w (DE-627)663366712  |w (DE-600)2615211-3  |w (DE-576)346641179  |x 2045-2322  |7 nnns 
773 1 8 |g volume:9  |g year:2019  |g day:5  |g month:08  |g elocationid:11325  |g pages:1-8 
856 4 0 |u https://doi.org/10.1038/s41598-019-47690-8  |x Resolving-System  |z kostenfrei  |3 Volltext 
856 4 0 |u https://www.db-thueringen.de/receive/dbt_mods_00039301  |m DE-601  |x Verlag  |z kostenfrei  |3 Volltext 
936 u w |d 9  |j 2019  |b 5  |c 8  |i 11325  |h 1-8 
951 |a AR 
856 4 0 |u https://doi.org/10.1038/s41598-019-47690-8  |9 LFER 
856 4 0 |u https://www.db-thueringen.de/receive/dbt_mods_00039301  |9 LFER 
852 |a LFER  |z 2020-02-17T00:00:00Z 
970 |c OD 
971 |c EBOOK 
972 |c EBOOK 
973 |c Aufsatz 
935 |a lfer 
900 |a Mozafari, Mahsa 
900 |a Jacobs, Heiko Otto 
900 |a Jacobs, Heiko 
951 |b XA-DE 
980 |a 1669944182  |b 0  |k 1669944182  |c lfer 
openURL url_ver=Z39.88-2004&ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fvufind.svn.sourceforge.net%3Agenerator&rft.title=Fluidic+self-assembly+on+electroplated+multilayer+solder+bumps+with+tailored+transformation+imprinted+melting+points&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Adc&rft.creator=Kaltwasser%2C+Mahsa&rft.pub=&rft.format=Journal&rft.language=English&rft.issn=2045-2322
SOLR
_version_ 1780884364725321728
access_facet Electronic Resources
author Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O.
author_facet Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O.
author_role aut, aut, aut, aut, aut, aut, aut
author_sort Kaltwasser, Mahsa
author_variant m k mk, u s us, l l ll, s b sb, t s ts, a b ab, h o j ho hoj
callnumber-sort
collection lfer
container_reference 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
container_title Scientific reports
ctrlnum (DE-627)1669944182, (DE-599)KXP1669944182
doi_str_mv 10.1038/s41598-019-47690-8
facet_avail Online, Free
finc_class_facet not assigned
format ElectronicBookComponentPart
format_access_txtF_mv Article, E-Article
format_de105 Ebook
format_de14 Article, E-Article
format_de15 Article, E-Article
format_del152 Buch
format_detail_txtF_mv text-online-monograph-child
format_dezi4 e-Book
format_finc Article, E-Article
format_legacy ElectronicBookPart
format_strict_txtF_mv E-Article
geogr_code not assigned
geogr_code_person Germany
hierarchy_parent_id 0-663366712
hierarchy_parent_title Scientific reports
hierarchy_sequence 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
hierarchy_top_id 0-663366712
hierarchy_top_title Scientific reports
id 0-1669944182
illustrated Not Illustrated
imprint 2019
imprint_str_mv 2019
institution DE-D117, DE-105, LFER, DE-Ch1, DE-15, DE-14, DE-Zwi2
is_hierarchy_id 0-1669944182
is_hierarchy_title Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
isil_str_mv LFER
issn 2045-2322
kxp_id_str 1669944182
language English
last_indexed 2023-10-27T05:14:38.516Z
marc024a_ct_mv 10.1038/s41598-019-47690-8
match_str kaltwasser2019fluidicselfassemblyonelectroplatedmultilayersolderbumpswithtailoredtransformationimprintedmeltingpoints
mega_collection Verbunddaten SWB, Lizenzfreie Online-Ressourcen
misc_de105 EBOOK
multipart_link 346641179
multipart_part (346641179)9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8
names_id_str_mv (DE-588)120660607X, (DE-627)1692695185, (DE-588)1204931372, (DE-627)1690205067, (DE-588)1161959513, (DE-627)1025470966, (DE-576)507038045, (DE-588)12967477X, (DE-627)477115330, (DE-576)188639063, (DE-588)103023244X, (DE-627)734945639, (DE-576)378035339
publishDate 2019
publishDateSort 2019
publishPlace
publisher
record_format marcfinc
record_id 1669944182
recordtype marcfinc
rvk_facet No subject assigned
source_id 0
spelling Kaltwasser, Mahsa VerfasserIn (DE-588)120660607X (DE-627)1692695185 aut, Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs, 2019, Text txt rdacontent, Computermedien c rdamedia, Online-Ressource cr rdacarrier, Schmidt, Udo VerfasserIn (DE-588)1204931372 (DE-627)1690205067 aut, Lösing, Lars VerfasserIn aut, Biswas, Shantonu 1986- VerfasserIn (DE-588)1161959513 (DE-627)1025470966 (DE-576)507038045 aut, Stauden, Thomas VerfasserIn aut, Bund, Andreas 1969- VerfasserIn (DE-588)12967477X (DE-627)477115330 (DE-576)188639063 aut, Jacobs, Heiko O. 1970- VerfasserIn (DE-588)103023244X (DE-627)734945639 (DE-576)378035339 aut, Enthalten in Scientific reports [London] : Macmillan Publishers Limited, part of Springer Nature, 2011 9(2019) vom: 5. Aug., Artikel-ID 11325, Seite 1-8 Online-Ressource (DE-627)663366712 (DE-600)2615211-3 (DE-576)346641179 2045-2322 nnns, volume:9 year:2019 day:5 month:08 elocationid:11325 pages:1-8, https://doi.org/10.1038/s41598-019-47690-8 Resolving-System kostenfrei Volltext, https://www.db-thueringen.de/receive/dbt_mods_00039301 DE-601 Verlag kostenfrei Volltext, https://doi.org/10.1038/s41598-019-47690-8 LFER, https://www.db-thueringen.de/receive/dbt_mods_00039301 LFER, LFER 2020-02-17T00:00:00Z
spellingShingle Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O., Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
title Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
title_auth Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
title_full Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs
title_fullStr Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs
title_full_unstemmed Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs
title_in_hierarchy Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points / Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, Shantonu Biswas, Thomas Stauden, Andreas Bund & Heiko O. Jacobs,
title_short Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
title_sort fluidic self assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points
url https://doi.org/10.1038/s41598-019-47690-8, https://www.db-thueringen.de/receive/dbt_mods_00039301