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Effect of Ag on Sn–Cu and Sn–Zn lead free solders
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| Zeitschriftentitel: | Materials Science-Poland |
|---|---|
| Personen und Körperschaften: | , , |
| In: | Materials Science-Poland, 33, 2015, 2, S. 317-330 |
| Format: | E-Article |
| Sprache: | Englisch |
| veröffentlicht: |
Walter de Gruyter GmbH
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| Schlagwörter: |
| author_facet |
Alam, S.N. Mishra, Prerna Kumar, Rajnish Alam, S.N. Mishra, Prerna Kumar, Rajnish |
|---|---|
| author |
Alam, S.N. Mishra, Prerna Kumar, Rajnish |
| spellingShingle |
Alam, S.N. Mishra, Prerna Kumar, Rajnish Materials Science-Poland Effect of Ag on Sn–Cu and Sn–Zn lead free solders Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| author_sort |
alam, s.n. |
| spelling |
Alam, S.N. Mishra, Prerna Kumar, Rajnish 2083-134X Walter de Gruyter GmbH Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.1515/msp-2015-0048 <jats:title>Abstract</jats:title> <jats:p>Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.</jats:p> Effect of Ag on Sn–Cu and Sn–Zn lead free solders Materials Science-Poland |
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| title |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_unstemmed |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_full |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_fullStr |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_full_unstemmed |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_short |
Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_sort |
effect of ag on sn–cu and sn–zn lead free solders |
| topic |
Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science |
| url |
http://dx.doi.org/10.1515/msp-2015-0048 |
| publishDate |
2015 |
| physical |
317-330 |
| description |
<jats:title>Abstract</jats:title>
<jats:p>Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.</jats:p> |
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| author | Alam, S.N., Mishra, Prerna, Kumar, Rajnish |
| author_facet | Alam, S.N., Mishra, Prerna, Kumar, Rajnish, Alam, S.N., Mishra, Prerna, Kumar, Rajnish |
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| description | <jats:title>Abstract</jats:title> <jats:p>Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.</jats:p> |
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| institution | DE-L229, DE-D275, DE-Bn3, DE-Brt1, DE-Zwi2, DE-D161, DE-Gla1, DE-Zi4, DE-15, DE-Pl11, DE-Rs1, DE-105, DE-14, DE-Ch1 |
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| spelling | Alam, S.N. Mishra, Prerna Kumar, Rajnish 2083-134X Walter de Gruyter GmbH Mechanical Engineering Mechanics of Materials Condensed Matter Physics General Materials Science http://dx.doi.org/10.1515/msp-2015-0048 <jats:title>Abstract</jats:title> <jats:p>Lead and lead-containing compounds are considered as toxic substances due to their detrimental effect on the environment. Sn-based soldering systems, like Sn-Cu and Sn-Zn are considered as the most promising candidates to replace the eutectic Sn-Pb solder compared to other solders because of their low melting temperature and favorable properties. Eutectic Sn-0.7 wt.% Cu and near eutectic composition Sn-8 wt.% Zn solders have been considered here for study. For the Sn-Cu system, besides the eutectic Sn-0.7 wt.% Cu composition, Sn-1Cu and Sn-2Cu were studied. Three compositions containing Ag: Sn-2Ag-0.7Cu, Sn-2.5Ag-0.7Cu and Sn-4.5Ag-0.7Cu were also developed. Ag was added to the eutectic Sn-0.7 wt.% Cu composition in order to reduce the melting temperature of the eutectic alloy and to enhance the mechanical properties. For the Sn-Zn system, besides the Sn-8 wt.% Zn near eutectic composition, Sn-8Zn-0.05Ag, Sn-8Zn-0.1Ag and Sn-8Zn-0.2Ag solder alloys were developed. The structure and morphology of the solder alloys were analyzed using a scanning electron microscope (SEM), filed emission scanning electron microscope (FESEM), electron diffraction X-ray spectroscopy (EDX) and X-ray diffraction (XRD). Thermal analysis of the alloys was also done using a differential scanning calorimeter (DSC). Trace additions of Ag have been found to significantly reduce the melting temperature of the Sn-0.7 wt.% Cu and Sn-8 wt.% Zn alloys.</jats:p> Effect of Ag on Sn–Cu and Sn–Zn lead free solders Materials Science-Poland |
| spellingShingle | Alam, S.N., Mishra, Prerna, Kumar, Rajnish, Materials Science-Poland, Effect of Ag on Sn–Cu and Sn–Zn lead free solders, Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| title | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_full | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_fullStr | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_full_unstemmed | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_short | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| title_sort | effect of ag on sn–cu and sn–zn lead free solders |
| title_unstemmed | Effect of Ag on Sn–Cu and Sn–Zn lead free solders |
| topic | Mechanical Engineering, Mechanics of Materials, Condensed Matter Physics, General Materials Science |
| url | http://dx.doi.org/10.1515/msp-2015-0048 |